Indima Yama-abrasives Edayimane Ekuqhumeni Okuphezulu

Ukucacisa ukusika kufinyelelwa ngokusebenzisa izinhlayiya zedayimane zokwenziwa (kufika ku-10,000 HV ngesilinganiso seVickers) kusendlalelo sokusebenza sediski. Lezi zinhlayiya zihlakazeka ngendlela efanele emathrikhi enhlanganisela yensimbi ukuze kutholakale amatshe amasha amadayimane. Lesi sici sokuzicija, kanye nokuxhuma kwe-vacuum-brazed ebusweni benhliziyo kusuka kulesi sigaba kanye nobuchwepheshe bokubopha obushaywayo, kunciphise ukuhlanekezela kwe-blade ngaphansi kokusebenza kokusika ngakho-ke kugcinwe ku-± 0.1 mm uqonde esimweni sokuphenduka kwe-later

Ukucwaninga Ngezinto Ezisetshenziswayo Ukuze Kuqedwe Izinto Ezingashintsheki

Amadiski anamuhla okusika idayimane asebenzisa ama-nickel-cobalt alloys nama-hybrid polymer binder ukuze kwenziwe ngcono ukuqina kwe-abrasive nokuguguleka kwedayimane okulawulwayo. Izici eziyinhloko ezithinta ukuqedela indawo zihlanganisa:

Ifakti	Umthelela Ekuqedeni Ingaphezulu
Ukuphakamisana kwesithathu	Kunciphisa ukuguqulwa kwezinto ezibonakalayo okubangelwa ukushisa
Ubunzima Bokuxhuma	Kuvimbela ukuhlukaniswa kwamadayimane ngaphambi kwesikhathi
Ukuqhekeka	Kuthuthukisa ukuhlanzeka kwe-swarf ngesikhathi sokusika

I-geometry yeziteshi zokupholisa ezenziwe kahle kuma-disc okusika amanzi kunciphisa ukwakheka kwe-burr ngo-62% uma kuqhathaniswa nezindlela zokusika ezomile.

Ithonya Lesakhiwo Se-Blade Ekuqiniseni Ukusika Nasekhwalithi Yama-edge

Imiklamo ye-rim ehlukanisiwe idlulisa ukushisa ngokusebenzisa izikhala ezingama-120-200 ze-radial ukuze kuzinze lapho kusikwa izinto ezinesisindo. Ama-blade ane-rim eqhubekayo anezinhlaka zedayimane ezishiselwe i-laser athola ububanzi be-<0.3 mm bokukhipha imisebenzi eqondile njengokufaka ama-wafer we-semiconductor. Ukuqamba izinto ezintsha kwejometri yamazinyo angalingani kwenza kube nokwenzeka ukusika ngephasi elilodwa ngamakhonkolo aqinisiwe angu-40 mm ngokuphambuka komngcele okungaphansi kuka-0.5°.

Ukuqina Nokusebenza Kahle: Ukwenza Okuhle Kakhulu Ezindaweni Zokusebenza Zemboni

Ukugqokwa Nokuphila Isikhathi Eside Kwama-disc Okuqopha Amadayimane Ngaphansi Komthwalo Osindayo

Ukuqina kwezinga lezimboni kuvela:

1. Amandla we-bond matrix : Izibopho ezenziwe ngensimbi zikhuthazelela amandla aphakeme aphindwe kabili noma kathathu kunezinsimbi ze-resin
2. Izindlela zokuhlaziywa kwamadayimane : Ubukhulu bamadayimane obungama-40-50% enhloko uma kuqhathaniswa no-20-30% emaphethelweni okusika
3. Ubunjiniyela bokudlulisa ukushisa

Ukusika Izinto	Isilinganiso sokugqoka esiphakathi (mm3/hr)	Isici Esiyinhloko Sokucindezeleka
Ibhethone eliyimkisa	0.12	Izingxenye zokubumba
Ilepha yeporcelain	0.08	Ukulayishwa okuphazamisayo
Insimbi Yekhabhoni	0.25	Ukukhathala okushisayo

Ama-blade axhunywe nge-cobalt agcina ukusonteka kwe-±0.1mm emaphethelweni ngokusebenzisa imijikelezo yokusika engu-8,000 ku-quartzite.

Amadayimane Enziwe Ngokwenziwa Noma Emvelo: Ukusebenza Nezindleko Zokuhweba

Amadayimane enziwe ngomshini anikeza:

• ukuvumelana kwe-crystallographic okungu-98.7%
• Izimo zezinhlayiya ezilungiselelwe ukusebenzisana kwezinto ezithile
• izindleko eziphansi ezingama-40-60% ngekarati ngalinye

Nakuba idayimane lemvelo linikeza ukuqedela okubushelelezi kwe-ceramics ekhethekile, izinto zokwenziwa zilawula u-93% wokukhiqizwa kwe-blade yokwakha ngenxa yamaphethini wokugqoka abikezelayo.

Ukulinganisela Ukusebenza Ngejubane Eliphakeme Nempilo Yama-blade

Ukusika nge-RPM ephezulu (3,800-4,500) kusheshisa ukugqoka:

• ukuphakama kwezinga lokushisa elingu-120-150°C lapho kusikwa
• izinga lokuqoshwa kwedayimane elingu-0.02mm/sec

Ukusebenza kahle kudinga:

• Amanzi ageleza ngokushesha ngo-0.5-0.7 L/min ngamasondo angu-100 mm
• Ukuguqulwa kwengcindezi yokudla (3-5 N/mm2 nge-asphalt vs. 8-12 N/mm2 nge-granite)
• Imiklamo ye-rim ehlukanisiwe enciphisa ukugxila kokushisa ngo-40%

Ukuqamba Okusha Kwezobuchwepheshe Bokusika Idayimane Ukuze Kuthuthukiswe Ukusetshenziswa Kabusha

Ama-Electroplated Diamond Blades Nezinzuzo Zawo Zokucacisa

Ukuhlanganiswa kwe-nickel okuyingqayizivele kuqinisekisa ukusabalalisa okufanayo kwe-grit, okwenza kube nokunemba kwezinga le-micron kwengilazi, i-ceramics, nezinto zokwakha ezihamba ngezinyawo. Ukungabi bikho kwezinto ezihlanganisa izinto kunciphisa ukushisa okwakheka lapho kusikwa izinto eziyinkimbinkimbi.

Intuthuko Eyenziwe Ezingxenyeni Ezisebenzayo Zokuqhekeka Kwezinto Ezinkimbinkimbi

Izibopho ezixubile zensimbi-inhlaka ziguquguquka zibe nobulukhuni obuhlukahlukene, kancane kancane ziwohloke ukuze zibonise izingqimba ezintsha zedayimane. Imiklamo yezingxenye ezinamakhasi yenza kahle ukusebenza kukhonkolo oqiniswe nge-carbon fiber noma i-ceramics enamakhasi.

Ukufaka esikhundleni sobuchwepheshe nezingubo ezakhiwe ngamathuluzi ukuze kwandiswe isikhathi sokusebenza

Izinqubo zokulungisa kabusha zibuyisela ama-blade ezingeni lama-95% omthamo wawo wokuqala. Ama-nano-coatings asekelwe ku-titanium anciphisa ukuchoboza ngo-34%, anweba isikhathi sokuphila ngo-23x ekusetshenzisweni okunzima.

Izicelo Eziyinhloko Zama-Diamond Cutting Discs Ekwakheni Nasekukhiqizeni

Ukusika Ngokunembile Ukhonkolo Oqinisiwe, Ukwakha, Nezinto Ezihlanganisiwe Ezinzima

Ama-disc edayimane asikiwe nge-steel reinforced bar ebhentshini ngokwamandla okukhishwa kwe-± 0,5 mm. Ama-blade anemifantu ehlukanisiwe enza ngcono ukususwa kwemfucumfucu ekwakheni, anciphise ukungcola kothuli ngo-60%. Ama-blade ane-rim eqhubekayo anikeza imiphetho engenazo izikhala yamapulangwe e-quartz nama-ceramic armor plates.

Ama-Ultra-Thin Blades okusika ama-Microscale ku-Elektroniki nakuma-Semiconductors

Ama-blade anobukhulu obungama-micron angu-50200 asika ama-wafer e-silicon nezisekelo ze-ceramic ezinobubanzi obungaphansi kwama-micron angu-100. Imikhawulo yedayimane e-electroplated igcina ubulukhuni bomhlaba ngaphansi kuka-0.1 μm Ra ku-electronics eguquguqukayo.

Izitayela Zokuzenzakalela Nokuhlanganiswa Kwe-Smart Blade Yokusika Kwezimboni

• Ukugcina ukusetshenziswa kwezilawuli zokuxhumeka ne-Inthanethi : Landela ukugqokwa kwezinhlayiya ezihlabayo ngesikhathi sangempela
• Ukukhethwa kwe-blade okuqhutshwa yi-AI : Kunciphisa isikhathi sokusetha ngo-50%
• Izindwangu zokuzihlakaza : Yandisa isikhathi sokuphila se-blade ngo-34x

Imikhuba Engcono Kakhulu Yokusebenza Okuhlanzekile Kokuqhekeka Emikhakheni Yezimboni

Ukwenza ngcono izinga lokudla, ukusetshenziswa kwe-coolant, nesivinini sokusika ukuze uthole imiphumela emihle

Gcina isilinganiso sokudla esingu-0.080.15 mm/izino kanye nesivinini sokusika phakathi kuka-4,0006,500 RPM. Ukulethwa kwe-coolant okuphuthumayo kunciphisa ukusetshenziswa koketshezi ngo-30% kuyilapho kugcinwa ukuzinza kokushisa.

Izindlela Zokusika Ezomile Nezimanzi Ezisebenzisekeni Ezibucayi Njenge-Elektroniki

Ukusika ngamanzi kunciphisa ukuqhekeka okuncane ngama-40% lapho kusetshenzwa ama-wafer esilicon. Ama-blade omile okucindezela uthuli abamba u-98% wezinhlayiya lapho kusikwa i-graphene substrate. Ezakhiweni ezihlanganisiwe ze-carbon fiber, ukusika okumanzi kunciphisa izingozi zokuqedwa kwe-delamination ngo-55% kodwa kwandisa isikhathi sokusebenza ngo-15%.

Isikhombisi Sokuqala

Yini eyenza amadayimane enziwe ngomshini akhethwe kakhulu ukuze asetshenziswe ezimbonini?

Amadayimane enziwe ngokwenziwa ayathandwa ngenxa yokuqina kwawo okungu-98.7%, ukwakheka kwezinhlayiya okungahlelwa, kanye nezindleko eziphansi ezingama-40-60% ngekarati ngalinye uma kuqhathaniswa namadayimane emvelo. Ziqinisekisa ukuthi ziguga ngendlela ebonakalayo, okwenza zilungele ukukhiqizwa kwama-blade.

Ukusika ngamanzi kukuthuthukisa kanjani ukuphumelela kwezicelo ezibucayi?

Ukusika ngamanzi kuthuthukisa imiphumela ngokunciphisa ukuqhuma okuncane nokulawula ukwakheka kokushisa. Ezindaweni ezifana nokucutshungulwa kwama-wafer esilicon, kunciphisa ukuqhekeka okuncane ngamaphesenti angu-40 futhi lapho kusikwa izinto ezihlanganisiwe ze-carbon fiber, kunciphisa izingozi zokuqhekeka.

Kungani ukukhetha ukwakheka kweblade kubalulekile kuma-disc okusika idayimane?

Isakhiwo se-blade, njengokwakhiwa kwe-rim ehlukanisiwe, sidlala indima ebalulekile ekuchitheni ukushisa nasekugcineni ukuzinza kokusika. Ithonya ukunemba, ikakhulukazi emisebenzini yokusika njengokuqhekeka kwama-wafer we-semiconductor, kuqinisekisa ukuphambuka okuncane emaphethelweni.